Huawei to enhance cooperation with HiSilicon
Huawei Technologies will revamp its policy on chipsets for smartphones and enhance cooperation with its chipset subsidiary HiSilicon Technologies for the development of smartphones.
Huawei aims to reduce the number of platforms in the development of smartphones, with plans to discontinue the adoption of Texas Instruments’ OMAP platform after the release of the dual-core Ascend P1.
Huawei will launch its quad-core smartphone, the Ascend D1 Quad, in the fourth quarter this year, using HiSilicon’s quad-core K3V2 CPUs. Huawei also plans to roll out four smartphone models built on HiSilicon’s platform in 2013, including LTE-enabled models which support LTE Category 4 with data rates of 150Mbps. Huawei’s quad-core tablet PC, the MediaPad 10 FHD, will also adopt a HiSilicon 1.5GHz quad-core CPU, and come with a 10-inch IPS display and thickness of only 8.8mm. Huawei plans to introduce the model, which runs on Android 4.0.3, in Taiwan in the fourth quarter.